• ZW-500多功能,全覆蓋離線型AOI
  • ZW-500多功能,全覆蓋離線型AOI
  • ZW-500多功能,全覆蓋離線型AOI

ZW-500多功能,全覆蓋離線型AOI

所屬分類: 產品中心, 離線型AOI | 發布日期:2019-07-05 01:07:57

ZW-500是一款引導新領域多功能檢測創新AOI,配備最先進的矢量分析及深度學習算法,可檢測SMT貼片與DIP焊錫面各種疑難工藝問題。

產品詳情

ZW-500多功能,全覆蓋離線型AOI

ZW-500是一款引導新領域多功能檢測創新AOI,配備最先進的矢量分析及深度學習算法,可檢測SMT貼片與DIP焊錫面各種疑難工藝問題。

ZW-500技術參數 technical parameters

ZW-500技術參數 technical parameters 光學系統 Optical system
攝像機 Camera 500萬高速智能數字工業相機 5M High speed smart digital industrial camera
分辨率 Image resolution 10/15/20μm/Pixel(可選) 標配15μm/Pixel(對應FOV:38mm*30mm) 10/15/20μm/Pixel(optional) standard 15μm/Pixel(corresponding to FOV: 38mm * 30mm)
光學工業鏡頭 Optical industry lens 5M像素級遠心鏡頭,景深:8mm-10mm 5M Telecentric lens at pixel level of , depth of field: 8 mm - 10 mm
光源系統 Light source system 高亮RGB同軸環形多角度LED光源 High-brightness RGB coaxial ring multi angle LED light source
軟件系統Software system
檢測方法 Detection method 模版匹配,智能偵測,圓偵測,極性檢測,橋連檢測,亮度平均值,亮度最大值,亮度最小值,亮度抽取,亮度範圍,相對偏移,字符識別,兩端角度偵測,整版偵測,智能判定,電阻值識別,共線性測試,子元件生成,計算值,刮痕偵測,字符驗證,BGA值球檢測以及IPE等30多種算法 Template matching, intelligent detection, circular detection, polarity detection, bridge detection, brightness average, brightness maximum, brightness minimum, brightness extraction, brightness range, relative offset, character recognition, two-end angle detection, full-page detection, intelligent judgment, Resistance value recognition, common linear testing, component generation, calculation value, scratch detection, character verification, BGA value ball detection, IPE and more than 30 algorithms
特點 Characteristic IPE是Image Processing Expression 的縮寫,允許用戶使用簡單的表達式自定義圖像源,配合不同的算法可以組合出不同的效果,可以極大的提高檢出率和誤報率,系統中圖像源可以理解像素的點陣集合,每個像素由1到4個通道的數據表示,IPE 表達式可以對圖像源中的每個像素做獨立計算,生成新的圖像,可檢測板上任意位置多件 IPE is an abbreviation of Image Design Express. It allows users to customize image sources using simple expressions. Different algorithms can be combined with different effects, which can greatly improve the detection rate and error rate. The image source in the system can understand the pixel. Pixel set Each pixel is represented by data from 1 to 4 channels. IPE expressions can perform independent calculations of each pixel in the image source to generate new images that can detect multiple positions on the board
條碼識別 Bar code recognition 相機自動識別(一維碼或二維碼) Automatic camera recognition(one-dimensional or two-dimensional)
多Mark校準圖像 Mark calibration images 採用2個以上的Mark,支持使用不同類型的Mark同時校準圖像,使圖像恢復到理想狀態,從根源上解決圖像變形問題,提升檢測穩定性 Using more than 2 Mark, support the use of different types of Mark simultaneously calibrating the image to restore the image to an ideal state, solve the image deformation problem from the root, improve the stability of detection
操作 Operation 智能CAD導入,圖形化編程,自帶元件庫,根據元件形狀選擇標準自動生成檢測框,精確自動定位,微米位微調,製程快捷,支持無限制“撤銷”/“重做”操作,有效防止工程師編程時由於意外操作而引起錯誤,方便工程師做模擬測試 CAD import, graphical programming, built-in component library, automatic generation of detection boxes based on component shape selection standards, accurate automatic positioning, Micron bit fine-tuning, fast process, support for unlimited "undo" / "redo" operations, Effective prevention of engineer programming due to accidental operations caused by errors, to facilitate engineers to do simulation tests
圖像處理速度 Image Processing Speed FOV處理時間<170毫秒,0201元件 <10毫秒 FOV processing time <170ms,0201 chip <10ms
檢測覆蓋類型 Detect coverage type 錫膏印刷:有無、偏斜、少錫、多錫、斷路、污染、連錫等 Tin paste printing: there is no, tilt, less tin, more tin, broken road, pollution, even tin, etc
零件缺陷:缺件、偏移、歪斜、立碑、側立、翻件、極性反、錯件、破損、多件等 Parts defects: missing parts, offset, askew, monument, side stand, reverse parts, polarity, wrong parts, damage, multiple pieces, etc
焊點缺陷:少錫、多錫、連錫、虛焊、多件等 Welding spot defects: tin more, tin less, even tin, virtual welding, multiple pieces, etc
紅膠板:缺件、偏移、歪斜、立碑、側立、翻件、極性反、錯件、破損、溢膠、多件等 Red rubber plate: missing parts, offset, askew, monument, side stand, flip pieces, polarity reverse, wrong pieces, damage, spillage, multiple pieces, etc
波峰焊:插入針、無錫、少錫、多錫、虛焊、錫珠、錫洞、斷路、多件等 Wave peak welding: insert needles, Wuxi, Shaoxi, multi tin, virtual welding, tin beads, tin holes, broken roads, multiple pieces, etc
系統參數System parameters
PCB尺寸 PCB Size 30×30毫米~450×330毫米(可根據客戶要求定製更大尺寸) 30 x 30 mm ~ 450 x 330 mm(larger size available upon request)
PCB厚度 PCB thickness 0.3毫米~6毫米 0.3 mm ~ 6mm
PCB翹曲度 PCB warping degree ≤6毫米(有夾具輔助矯正變形)可消除PCB變形影響(特殊要求可定製) ≤6mm(with fixture assisted deformation) can eliminate PCB deformation(special requirements can be customized)
PCB夾板方式 PCB splint method 自動張開或收起的雙邊夾具 Bilateral fixture automatically opened or closed
PCB零件高度 PCB Part height 上凈高≤35mm ,下凈高≤70mm (特殊要求可訂製) Top Side ≤35mm,Bottom Side ≤70mm (Special requirements are customizable)
最小零件 Minimum part 01005元件,0.3毫米間距及以上IC 01005 Chip, 0.3 mm spacing and above IC
PCB重量 PCB Weight ≤3KG
X、Y平台驅動 X/Y Driver 絲桿導軌及交流伺服電機系統 Silk rod guide rail and AC servo motor system
Y軸:大理石基台,定位精確 <10μm Y axis marble, precise positioning <10μm
操作系統 Operating system Windows 10
電腦主機 Computer host i5 CPU,8G GPU顯卡,16G內存,120G固態硬盤,1TB機械硬盤 I5 CPU, 8G GPU graphics card, 16G memory, 120G SSD, 1TB mechanical hard disk
顯示器 Display 21.5英寸液晶寬屏 21.5 inch LCD wide screen
設備外形尺寸 Dimension 110厘米×90厘米×135厘米 (L×W×H) 高度含地腳 110 cm x 90 cm x 135 cm(L x W x H) height ground foot
設備重量 Weight 約400KG About 400KG
環境溫濕度 Humidity 5~40℃ 35~80% RH(無結露) 5~40℃ 35~80% RH(No dew)
電源 Power supply 交流220伏特±10%,頻率50/60Hz,額定功率1.2KW AC 220 volts ± 10 %, frequency 50/60 Hz, rated power 1.2 KW
選配項 Selection 頂針,離線編程軟件,外接條碼槍 Thimble, offline programming software, external barcode gun

註:以上技術參數為標準配置

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