ZW-500多功能,全覆盖离线型AOI
ZW-500是一款引导新领域多功能检测创新AOI，配备最先进的矢量分析及深度学习算法，可检测SMT贴片与DIP焊锡面各种疑难工艺问题。
ZW-500技术参数 technical parameters
| ZW-500技术参数 technical parameters 光学系统 Optical system | ||
|---|---|---|
| 摄像机 Camera | 500万高速智能数字工业相机 5M High speed smart digital industrial camera | |
| 分辨率 Image resolution | 10/15/20μm/Pixel（可选） 标配15μm/Pixel（对应FOV：38mm*30mm） 10/15/20μm/Pixel(optional) standard 15μm/Pixel(corresponding to FOV: 38mm * 30mm) | |
| 光学工业镜头 Optical industry lens | 5M像素级远心镜头，景深：8mm-10mm 5M Telecentric lens at pixel level of , depth of field: 8 mm - 10 mm | |
| 光源系统 Light source system | 高亮RGB同轴环形多角度LED光源 High-brightness RGB coaxial ring multi angle LED light source | |
| 软件系统Software system | ||
| 检测方法 Detection method | 模版匹配，智能侦测，圆侦测，极性检测，桥连检测，亮度平均值，亮度最大值，亮度最小值，亮度抽取，亮度范围，相对偏移，字符识别，两端角度侦测，整版侦测，智能判定，电阻值识别，共线性测试，子元件生成，计算值，刮痕侦测,字符验证，BGA值球检测以及IPE等30多种算法 Template matching, intelligent detection, circular detection, polarity detection, bridge detection, brightness average, brightness maximum, brightness minimum, brightness extraction, brightness range, relative offset, character recognition, two-end angle detection, full-page detection, intelligent judgment, Resistance value recognition, common linear testing, component generation, calculation value, scratch detection, character verification, BGA value ball detection, IPE and more than 30 algorithms | |
| 特点 Characteristic | IPE是Image Processing Expression 的缩写，允许用户使用简单的表达式自定义图像源，配合不同的算法可以组合出不同的效果，可以极大的提高检出率和误报率，系统中图像源可以理解像素的点阵集合，每个像素由1到4个通道的数据表示，IPE 表达式可以对图像源中的每个像素做独立计算，生成新的图像，可检测板上任意位置多件 IPE is an abbreviation of Image Design Express. It allows users to customize image sources using simple expressions. Different algorithms can be combined with different effects, which can greatly improve the detection rate and error rate. The image source in the system can understand the pixel. Pixel set Each pixel is represented by data from 1 to 4 channels. IPE expressions can perform independent calculations of each pixel in the image source to generate new images that can detect multiple positions on the board | |
| 条码识别 Bar code recognition | 相机自动识别（一维码或二维码） Automatic camera recognition(one-dimensional or two-dimensional) | |
| 多Mark校准图像 Mark calibration images | 采用2个以上的Mark，支持使用不同类型的Mark同时校准图像，使图像恢复到理想状态，从根源上解决图像变形问题，提升检测稳定性 Using more than 2 Mark, support the use of different types of Mark simultaneously calibrating the image to restore the image to an ideal state, solve the image deformation problem from the root, improve the stability of detection | |
| 操作 Operation | 智能CAD导入，图形化编程，自带元件库，根据元件形状选择标准自动生成检测框,精确自动定位，微米位微调，制程快捷,支持无限制“撤销”/“重做”操作，有效防止工程师编程时由于意外操作而引起错误，方便工程师做模拟测试 CAD import, graphical programming, built-in component library, automatic generation of detection boxes based on component shape selection standards, accurate automatic positioning, Micron bit fine-tuning, fast process, support for unlimited "undo" / "redo" operations, Effective prevention of engineer programming due to accidental operations caused by errors, to facilitate engineers to do simulation tests | |
| 图像处理速度 Image Processing Speed | FOV处理时间<170毫秒，0201元件 <10毫秒 FOV processing time <170ms，0201 chip <10ms | |
| 检测覆盖类型 Detect coverage type | 锡膏印刷：有无、偏斜、少锡、多锡、断路、污染、连锡等 Tin paste printing: there is no, tilt, less tin, more tin, broken road, pollution, even tin, etc | |
| 零件缺陷：缺件、偏移、歪斜、立碑、侧立、翻件、极性反、错件、破损、多件等 Parts defects: missing parts, offset, askew, monument, side stand, reverse parts, polarity, wrong parts, damage, multiple pieces, etc | ||
| 焊点缺陷：少锡、多锡、连锡、虚焊、多件等 Welding spot defects: tin more, tin less, even tin, virtual welding, multiple pieces, etc | ||
| 红胶板：缺件、偏移、歪斜、立碑、侧立、翻件、极性反、错件、破损、溢胶、多件等 Red rubber plate: missing parts, offset, askew, monument, side stand, flip pieces, polarity reverse, wrong pieces, damage, spillage, multiple pieces, etc | ||
| 波峰焊：插入针、无锡、少锡、多锡、虚焊、锡珠、锡洞、断路、多件等 Wave peak welding: insert needles, Wuxi, Shaoxi, multi tin, virtual welding, tin beads, tin holes, broken roads, multiple pieces, etc | ||
| 系统参数System parameters | ||
| PCB尺寸 PCB Size | 30×30毫米～450×330毫米(可根据客户要求定制更大尺寸) 30 x 30 mm ～ 450 x 330 mm(larger size available upon request) | |
| PCB厚度 PCB thickness | 0.3毫米～6毫米 0.3 mm ～ 6mm | |
| PCB翘曲度 PCB warping degree | ≤6毫米（有夹具辅助矫正变形）可消除PCB变形影响（特殊要求可定制） ≤6mm(with fixture assisted deformation) can eliminate PCB deformation(special requirements can be customized) | |
| PCB夹板方式 PCB splint method | 自动张开或收起的双边夹具 Bilateral fixture automatically opened or closed | |
| PCB零件高度 PCB Part height | 上净高≤35mm ，下净高≤70mm (特殊要求可订制) Top Side ≤35mm，Bottom Side ≤70mm (Special requirements are customizable) | |
| 最小零件 Minimum part | 01005元件，0.3毫米间距及以上IC 01005 Chip, 0.3 mm spacing and above IC | |
| PCB重量 PCB Weight | ≤3KG | |
| X、Y平台驱动 X/Y Driver | 丝杆导轨及交流伺服电机系统 Silk rod guide rail and AC servo motor system | |
| Y轴：大理石基台，定位精确 <10μm Y axis marble, precise positioning <10μm | ||
| 操作系统 Operating system | Windows 10 | |
| 电脑主机 Computer host | i5 CPU,8G GPU显卡,16G内存，120G固态硬盘，1TB机械硬盘 I5 CPU, 8G GPU graphics card, 16G memory, 120G SSD, 1TB mechanical hard disk | |
| 显示器 Display | 21.5英寸液晶宽屏 21.5 inch LCD wide screen | |
| 设备外形尺寸 Dimension | 110厘米×90厘米×135厘米 （L×W×H） 高度含地脚 110 cm x 90 cm x 135 cm(L x W x H) height ground foot | |
| 设备重量 Weight | 约400KG About 400KG | |
| 环境温湿度 Humidity | 5～40℃ 35～80％ RH（无结露） 5～40℃ 35～80％ RH（No dew） | |
| 电源 Power supply | 交流220伏特±10%，频率50/60Hz，额定功率1.2KW AC 220 volts ± 10 %, frequency 50/60 Hz, rated power 1.2 KW | |
| 选配项 Selection | 顶针，离线编程软件，外接条码枪 Thimble, offline programming software, external barcode gun | |
注：以上技术参数为标准配置
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